Printed Circuit Board

  • Standard Advanced Cutting Edge
  • Minimµm Inner Line Width 100 75 50
  • Minimµm Outer Space 100 100 75
  • Minimµm Outer Space 100 75 50
  • Minimµm Inner Space 100

Plotter Line

Manufacturing Capabilities

Rigid PCB
  • Number of layers: 1 – 52
  • Materials: High performance FR4, rigid polyimide, low loss hydrocarbon, low loss PTEF
  • Copper weights (finished): 18 μm – 105 μm
  • Minimum line/space: 0.075 mm / 0.075 mm
  • Minimum core thickness: 0.1 mm
  • Thickness range: 0.6 mm – 3.2 mm
  • Available panels dimensions: 610×457 or 560×457
  • Surface finishes available: HASL, LF HASL, OSP, ENIG
  • Minimum mechanical drill: 0.15 mm
Flexible PCB
  • Number of layers: 1 – 4 L
  • Materials: Flex polyimide
  • Copper weights (finished): 18 μm – 35μ
  • Minimum line/space: 0.075 mm / 0.075 mm
  • Minimum core thickness: 0.025 mm
  • Thickness range: 0.03 mm – 0.1 mm
  • Available panels dimensions: 610×457 or 560×457
  • Surface finishes available: OSP, ENIG
  • Minimum mechanical drill: 0.15 mm
  • Minimum laser drill: 0.075 mm
Rigid Flex PCB
  • Number of layers: 4-16 layers
  • Materials: High performance FR4, Rigid polyimide, Flex Polyimide
  • Copper weights (finished): 18 μm – 70 μm
  • Minimum line/space: 0.075 mm / 0.075 mm
  • Minimum core thickness: For Flex (0.025 mm) For Rigid (0.1 mm
  • Thickness range: 0.4 mm – 3.2 mm
  • Available panels dimensions: 610×457 or 560×457
  • Surface finishes available: OSP, ENIG
  • Minimum mechanical drill: 0.15 mm
  • Minimum laser drill: 0.075 mm
HDI PCB
  • Number of layers: 1 – 52
  • Materials: High performance FR4, rigid polyimide, low loss hydrocarbon, low loss PTEF
  • Copper weights (finished): 18 μm – 105 μm
  • Minimum line/space: 0.075 mm / 0.075 mm
  • Minimum core thickness: 0.1 mm
  • Thickness range: 0.6 mm – 3.2 mm
  • Available panels dimensions: 610×457 or 560×457
  • Surface finishes available: HASL, LF HASL, OSP, and ENIG
  • Minimum mechanical drill: 0.15 mm
  • Minimum laser drill: 0.05 mm
Plated Through Hole Minimum finished diameter 150 μm-Aspect Ratio for PTH: ≤ 15
Blind Micro viaMinimum diameter 50μm (laser drilled) -Aspect Ratio for blind vias: ≤ 1
µVias TreatmentCapped through vias and resin filled blind vias, Copper filled
Fine LineMinimum track/spacing is 50 μm, ±10 tolerance
Layer CountStandard up to 32, special requirement up to 50 after DFM evaluation
Flexible Layer CountUp to 16 inner layers in a Rigid-Flex build up, special requirement after DFM evaluation
Sequential Lamination Up to 3+N+3 (SBU), special requirement after DFM evaluation
Base Cu ThicknessThin copper 9 μm, 12 μm, 18μm, 35 μm, 70 μmup to 105μm.
Minimum Inner Layer Thickness 50 μm, special requirement after DFM evaluation
Minimum Prepreg Thickness50 μm(1 x PP106) or lower but after DFM evaluation (PP1027 or Pp1037)
Maximum PCB Thickness !"#$%#&% '() ** special requirement up to 5.2 mm after DFM evaluation
Maximum PCB Dimensions Multilayer: 420 x 525 mm, SS,DS 420X585
Solder MaskSpray Coating or screen printed (Green, Blue, Black, Red & White)
Solder Mask Capability Solder Dam 75 μm standard and 50 μm special; Clearance down to 50 μm.
Vias TreatmentTenting and plugging process like per IPC classification
Printing ApplicationLegend, Peelable mask.
FinishingHASL with/without Lead; ENIG, OSP ; As per special requirements.
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