Manufacturing Capabilities
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Number of layers: 1 – 52
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Materials: High performance FR4, rigid polyimide, low loss hydrocarbon, low loss PTEF
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Copper weights (finished): 18 μm – 105 μm
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Minimum line/space: 0.075 mm / 0.075 mm
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Minimum core thickness: 0.1 mm
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Thickness range: 0.6 mm – 3.2 mm
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Available panels dimensions: 610×457 or 560×457
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Surface finishes available: HASL, LF HASL, OSP, ENIG
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Minimum mechanical drill: 0.15 mm
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Number of layers: 1 – 4 L
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Materials: Flex polyimide
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Copper weights (finished): 18 μm – 35μ
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Minimum line/space: 0.075 mm / 0.075 mm
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Minimum core thickness: 0.025 mm
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Thickness range: 0.03 mm – 0.1 mm
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Available panels dimensions: 610×457 or 560×457
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Surface finishes available: OSP, ENIG
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Minimum mechanical drill: 0.15 mm
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Minimum laser drill: 0.075 mm
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Number of layers: 4-16 layers
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Materials: High performance FR4, Rigid polyimide, Flex Polyimide
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Copper weights (finished): 18 μm – 70 μm
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Minimum line/space: 0.075 mm / 0.075 mm
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Minimum core thickness: For Flex (0.025 mm) For Rigid (0.1 mm
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Thickness range: 0.4 mm – 3.2 mm
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Available panels dimensions: 610×457 or 560×457
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Surface finishes available: OSP, ENIG
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Minimum mechanical drill: 0.15 mm
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Minimum laser drill: 0.075 mm
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Number of layers: 1 – 52
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Materials: High performance FR4, rigid polyimide, low loss hydrocarbon, low loss PTEF
-
Copper weights (finished): 18 μm – 105 μm
-
Minimum line/space: 0.075 mm / 0.075 mm
-
Minimum core thickness: 0.1 mm
-
Thickness range: 0.6 mm – 3.2 mm
-
Available panels dimensions: 610×457 or 560×457
-
Surface finishes available: HASL, LF HASL, OSP, and ENIG
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Minimum mechanical drill: 0.15 mm
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Minimum laser drill: 0.05 mm
| Plated Through Hole | Minimum finished diameter 150 μm-Aspect Ratio for PTH: ≤ 15 |
| Blind Micro via | Minimum diameter 50μm (laser drilled) -Aspect Ratio for blind vias: ≤ 1 |
| µVias Treatment | Capped through vias and resin filled blind vias, Copper filled |
| Fine Line | Minimum track/spacing is 50 μm, ±10 tolerance |
| Layer Count | Standard up to 32, special requirement up to 50 after DFM evaluation |
| Flexible Layer Count | Up to 16 inner layers in a Rigid-Flex build up, special requirement after DFM evaluation |
| Sequential Lamination | Up to 3+N+3 (SBU), special requirement after DFM evaluation |
| Base Cu Thickness | Thin copper 9 μm, 12 μm, 18μm, 35 μm, 70 μmup to 105μm. |
| Minimum Inner Layer Thickness | 50 μm, special requirement after DFM evaluation |
| Minimum Prepreg Thickness | 50 μm(1 x PP106) or lower but after DFM evaluation (PP1027 or Pp1037) |
| Maximum PCB Thickness | Standard 3.2mm special requirement up to 5.2 mm after DFM evaluation |
| Maximum PCB Dimensions | Multilayer: 420 x 525 mm, SS,DS 420X585 |
| Solder Mask | Spray Coating or screen printed (Green, Blue, Black, Red & White) |
| Solder Mask Capability | Solder Dam 75 μm standard and 50 μm special; Clearance down to 50 μm. |
| Vias Treatment | Tenting and plugging process like per IPC classification |
| Printing Application | Legend, Peelable mask. |
| Finishing | HASL with/without Lead; ENIG, OSP ; As per special requirements. |
| ITEM | DESCRIPTION | STANDARD | ADVANCED | CUTTING EDGE |
| Track & Gap | Line / Space inner | 100 | 75 | 50 |
| Line / Space inner | 100 | 75 | 60 | |
| Minimum Outer Layer Annular Ring (OAR) on Production Hole Diameter (PHD | 150 | 100 | 75 | |
| Minimum Inner Layer Annular Ring (IAR) / Thermal Annular Ring on PHD | 150 | 100 | 75 | |
| Hole Diameter | Minimum Production Hole Diameter (PHD) for thickness 1.6 mm (Others: see table) | 200 | 150 | 150 |
| Maximum aspect ratio PTH: see also table (Thickness / PHD) | 8 | 12 | 15 | |
| μVia –Buried | Minimum blind μvia drill diameter -material with glass | 150 | 100 | 50 |
| Maximum blind μviaaspect ratio | 1 | 1 | 1.2 | |
| Minimum blind μvia drill diameter -material without glass | 125 | 100 | 50 | |
| μViatop pad annular ring | 150 | 100 | 75 | |
| μVialanding pad annular ring | 150 | 100 | 75 | |
| Maximum number of stack via | 1 | 2 | 3 | |
| Drill \Cu Distance | PTH to cu on inner layers (means IAR + Value) | 250 | 200 | 150 |
| NPTH to cu on inner layers /NPTH Routing always>250 μm(means IAR+Value) | 250 | 200 | 150 | |
| NPTH to cu on outer layers ( NPTH Routing always >200 μm) | 250 | 200 | 150 | |
| Routing Tolerance | 200 | 200 | 100 | |
| Solder Mask | Solder mask Registration +\-40 μm | +\-40 | +\-40 | +\-40 |
| Solder mask Thickness Above copper >=5 μm | >=5 | >=5 | >=5 | |
| Minimum SM DAM | 150 | 100 | 50 | |
| Build up | Maximum PCB thickness (mm) | 3.2 | 3.2 | 3.2 |
| Minimum PCB thickness tolerance (%) | 10 | 10 | 10 | |
| Maximum number of Layers for Rigid-Flex PCB | 8 | 12 | 16 |
| Material for Rigid PCB | Material for Flex PCB | High Frequency Materials |
| Isola 402, Isola 185Hr | DuPont PyraluxAP | Roger 3000 Series |
| Panasonic Megtron6 Isola P95 (Rigid Polyimid) | DuPont PyraluxLF | Roger 4000 Series |
| Any other material for special requirements. | Any other material for special requirements. | Any other material for special requirements. |